GitHub - TravisDai/HotSpot: HotSpot is an accurate and fast thermal model suitable for use in architectural studies.

TravisDai / HotSpot Public

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HotSpot is an accurate and fast thermal model suitable for use in architectural studies.

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Name		Name	Last commit message	Last commit date
Latest commit History 2 Commits
3D_testcase		3D_testcase
README_archive		README_archive
3Dfig.pl		3Dfig.pl
3Dfig2pdf.sh		3Dfig2pdf.sh
HOWTO		HOWTO
LICENSE		LICENSE
Makefile		Makefile
RCutil.c		RCutil.c
README-6.0		README-6.0
Validation.config		Validation.config
avg.p		avg.p
ev6.desc		ev6.desc
ev6.flp		ev6.flp
ev6.flp.orig		ev6.flp.orig
example.flp		example.flp
example.lcf		example.lcf
example.ptrace		example.ptrace
flp.c		flp.c
flp.h		flp.h
flp_desc.c		flp_desc.c
gcc.grid.steady		gcc.grid.steady
gcc.init		gcc.init
gcc.pdf		gcc.pdf
gcc.ptrace		gcc.ptrace
gcc.ptrace.orig		gcc.ptrace.orig
gcc.steady		gcc.steady
grid_thermal_map.pl		grid_thermal_map.pl
hotfloorplan.c		hotfloorplan.c
hotfloorplan.h		hotfloorplan.h
hotspot-iface.h		hotspot-iface.h
hotspot.c		hotspot.c
hotspot.config		hotspot.config
hotspot.h		hotspot.h
hsconvert-data.pl		hsconvert-data.pl
hsconvert-flp.pl		hsconvert-flp.pl
layer.lcf		layer.lcf
npe.c		npe.c
npe.h		npe.h
oil_bare_silicon.config		oil_bare_silicon.config
output.flp		output.flp
output.pdf		output.pdf
package.c		package.c
package.config		package.config
package.h		package.h
shape.c		shape.c
shape.h		shape.h
sim-template.c		sim-template.c
temperature.c		temperature.c
temperature.h		temperature.h
temperature_block.c		temperature_block.c
temperature_block.h		temperature_block.h
temperature_grid.c		temperature_grid.c
temperature_grid.h		temperature_grid.h
temperature_mobile.c		temperature_mobile.c
tofig.pl		tofig.pl
util.c		util.c
util.h		util.h
wire.c		wire.c
wire.h		wire.h

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LICENSE
-------

LICENSE TERMS

Copyright (c)2003-2015. All rights reserved.

Permission is hereby granted, without written agreement and without license or
royalty fees, to use, copy, modify, and distribute this software and its
documentation for any purpose, provided that the above copyright notice and the
following four paragraphs appear in all copies of this software, whether in
binary form or not.

IN NO EVENT SHALL THE AUTHORS, THE UNIVERSITY OF VIRGINIA, OR THE STATE OF
VIRGINIA BE LIABLE TO ANY PARTY FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL, OR
CONSEQUENTIAL DAMAGES ARISING OUT OF THE USE OF THIS SOFTWARE AND ITS
DOCUMENTATION, EVEN IF THEY HAVE BEEN ADVISED OF THE POSSIBILITY OF SUCH
DAMAGE.

THE AUTHORS, THE UNIVERSITY OF VIRGINIA, AND THE STATE OF VIRGINIA SPECIFICALLY
DISCLAIM ANY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. THE SOFTWARE PROVIDED
HEREUNDER IS ON AN "AS IS" BASIS, AND THE AUTHORS HAVE NO OBLIGATION TO PROVIDE
MAINTENANCE, SUPPORT, UPDATES, ENHANCEMENTS, OR MODIFICATIONS.

NEITHER THE NAME OF ANY VIRGINIA ENTITY NOR THE NAMES OF THE CONTRIBUTORS MAY
BE USED TO ENDORSE OR PROMOTE PRODUCTS DERIVED FROM THIS SOFTWARE WITHOUT
SPECIFIC PRIOR WRITTEN PERMISSION.

If you use this software or a modified version of it, we would appreciate it if
you would cite one of the following papers:

1) K. Skadron, M. R. Stan, W. Huang, S. Velusamy, D.  Tarjan, and K.
   Sankaranarayanan, "Temperature-Aware Microarchitecture." In Proceedings of
   the 30th International Symposium on Computer Architecture, June 2003

2) W. Huang, M. R. Stan, K. Skadron, K. Sankaranarayanan, S. Ghosh, and
   S. Velusamy, "Compact Thermal Modeling for Temperature-Aware Design." 
   In Proceedings of the 41st Design Automation Conference, June 2004.

3) K. Sankaranarayanan, S. Velusamy, M. R. Stan, and K. Skadron, "A Case 
   for Thermal-Aware Floorplanning at the Microarchitectural Level.",
   Journal of Instruction-Level Parallelism, June 2005.

4) W. Huang, K. Sankaranarayanan, R. J. Ribando, M. R. Stan, and K. Skadron,
   "Accurate, Pre-RTL Temperature-Aware Processor Design Using a Parameterized, 
   Geometric Thermal Model Considerations." IEEE Transactions on Computers, 
   57(9):1277-88, September 2008.

5) W. Huang, K. Skadron, S. Gurumurthi, R. J. Ribando, and M. R. Stan,
   "Differentiating the Roles of IR Measurement and Simulation of Power and 
   Temperature-Aware Design" In Proceedings of the 2009 IEEE International 
   Symposium on Performance Analysis of Systems and Software (ISPASS).
   April. 2009

6) R. Zhang, M. R. Stan, and K. Skadron, "HotSpot 6.0: Validation,
   Acceleration and Extension." University of Virginia, Tech. Report
   CS-2015-04